Description
Our AOI Solutions Supported the Backend of Semiconductor Manufacturing Process
Finished Wafer
Wafer Inspection
Wafer Sawing
Wafer Inspection
Die Attachment
Die Inspection
Wire Bonding
Tape & Reel Inspection
IC Inspection
Lead Marking
Leads Cutting
Leadframe Inspection
Package Moulding
Wirebond Inspection
VEGA SERIES
Precision 3D Wirebond and Die Bond AOI Solution
Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on wirebond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the many types of products (Leadframe, Substrate & Pallet, Grip ring, wafflepack, gelpack, JDEC tray) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defect but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.
Vega Series-Fully automation with dual loadport for Flexible input & Output with minimal recipe adjustments.
Pulsar Series – Compact in size, allowing easy integration into inline production and optimizing factory space.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects process
Improve Reputation
Less defects products increase
customer satisfaction
Reduce Wastage
Defects can be detect at the earlier
stage
Save Time & Cost
Process can be simplify and less
labour cost
24 hours operation
Maximize production yield
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
One AOI Machine
Multiple types defects inspection
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
3D Inspection for BLT & Loop Height
Multi-Choice Reject Modules
Multiple Magazine Conveyor
1D / 2D / RFID Magazine Reader
Other Features
8 to 1 Centralised Verification System
Centralised Recipe for Handler & Vision
Stacked Die Out of Focus Handling
Wire Tracing Technology (Full Wire Coverage)
Automatic Defects Classifier Host Support
Auto Focus (Warp Compensation)
Smart Recipe - Auto Search Ball/Weld & Wire Path
SECSGEM Compatible
Optional Features
Offline Teaching
Bottom Multi-view Inspection
Long Term Storage (Up to 3 Months)
Offline Verification Before Reject
INSPECTION PRODUCTS
Substrate, Leadframe and Pallet
INSPECTION CAPABILITIES
Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch, cross wire, J wire, wire neck, wire heel and golf/club ball
