Description
Our AOI Solutions Supported the Backend of Semiconductor Manufacturing Process


VEGA SERIES
High Precision 3D Wirebond AOI Solution
Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on wirebond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defect but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.
BENEFITS OF AOI INSPECTION
To Business

Full Solution
Check, Mark, Sort

Increase Quality
Quick identify & Fix defects process

Improve Reputation
Less defects products increase
customer satisfaction

Reduce Wastage
Defects can be detect at the earlier
stage

Save Time & Cost
Process can be simplify and less
labour cost

24 hours operation
Maximize production yield
To User

Inspection cover each unit of
products without miss

Data Collection
Enabling tracking & data analysis

One AOI Machine
Multiple types defects inspection

Easy Control
Simple Instruction manual with
own recipe setting

Reliable Result
Consistent inspection criteria

100% Automatic Process
Replace manual inspection
Key Features
Multiple Magazine Conveyor

1D / 2D / RFID Magazine Reader

Other Features
Quality Analysis System

Generate Report

E-Map

High-Resolution Camera & Auto focusing

8 to 1 Centralised Verification System

SECSGEM Compatible

Auto frame width Adjustment

Able to perform offline verification before reject

Optional Features
Reject Modules (inking, sorter & laser marking)

Bottom inspection

Long Term Storage (up to 3 months)

Offline Teaching

INSPECTION PRODUCTS
Substrate, Leadframe and Pallet

INSPECTION CAPABILITIES
Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch
