Vega Wirebond AOI


Our AOI Solutions Supported the Backend of Semiconductor Manufacturing Process

Finished Wafer

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Wafer Inspection

Wafer Sawing

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Wafer Inspection

Die Attachment

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Die Inspection

die inspection AOI machine

Wire Bonding

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Tape & Reel Inspection

Tape and Reel Inspection machine

IC Inspection

Lead Marking

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Leads Cutting

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Leadframe Inspection

leadframe inspection machine

Package Moulding

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Wirebond Inspection

die inspection AOI machine


Precision 3D Wirebond and Die Bond AOI Solution

Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on wirebond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defect but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.


To Business

Full Solution Check, Mark, Sort icon

Full Solution
Check, Mark, Sort

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Increase Quality
Quick identify & Fix defects process

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Improve Reputation
Less defects products increase
customer satisfaction

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Reduce Wastage
Defects can be detect at the earlier

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Save Time & Cost
Process can be simplify and less
labour cost

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24 hours operation
Maximize production yield

To User

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Inspection cover each unit of
products without miss

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Data Collection
Enabling tracking & data analysis

multiple detection

One AOI Machine
Multiple types defects inspection

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Easy Control
Simple Instruction manual with
own recipe setting

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Reliable Result
Consistent inspection criteria

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100% Automatic Process
Replace manual inspection

Key Features

3D Inspection for BLT & Loop Height

Different wire heights will be indicated in a different colour

Multi-Choice Reject Modules

Multiple Magazine Conveyor

multiple magazine conveyor

1D / 2D / RFID Magazine Reader

1D / 2D / RFID Magazine Reader

Other Features

8 to 1 Centralised Verification System

Centralised Recipe for Handler & Vision

Stacked Die Out of Focus Handling

Wire Tracing Technology (Full Wire Coverage)

Automatic Defects Classifier Host Support

Auto Focus (Warp Compensation)

Smart Recipe - Auto Search Ball/Weld & Wire Path

SECSGEM Compatible

Optional Features

Offline Teaching

Bottom Multi-view Inspection

Long Term Storage (Up to 3 Months)

Offline Verification Before Reject


Substrate, Leadframe and Pallet

Substrate, Leadframe and Pallet


Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch, cross wire, J wire, wire neck, wire heel and golf/club ball

Die & Leadframe Defects Inspection