Vega Wirebond AOI


Our AOI Solutions Supported the Backend of Semiconductor Manufacturing Process

Finished Wafer

finished wafer icon

Wafer Inspection

Wafer Sawing

wafer sawing icon

Wafer Inspection

Die Attachment

die attachments icon

Die Inspection

die inspection AOI machine

Wire Bonding

wire bonding icon

Tape & Reel Inspection

Tape and Reel Inspection machine

IC Inspection

Lead Marking

lead marking icon

Leads Cutting

leads cutting icon

Leadframe Inspection

leadframe inspection machine

Package Moulding

package moulding icon

Wirebond Inspection

die inspection AOI machine


High Precision 3D Wirebond AOI Solution

Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on wirebond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defect but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.


To Business

Full Solution Check, Mark, Sort icon

Full Solution
Check, Mark, Sort

winner badge

Increase Quality
Quick identify & Fix defects process

brand icon

Improve Reputation
Less defects products increase
customer satisfaction

reduce waste icon

Reduce Wastage
Defects can be detect at the earlier

time and money icon

Save Time & Cost
Process can be simplify and less
labour cost

24 hours icon

24 hours operation
Maximize production yield

To User

inspection icon

Inspection cover each unit of
products without miss

data collection icon

Data Collection
Enabling tracking & data analysis

multiple detection

One AOI Machine
Multiple types defects inspection

easy control icon

Easy Control
Simple Instruction manual with
own recipe setting

reliable result icon

Reliable Result
Consistent inspection criteria

auto icon

100% Automatic Process
Replace manual inspection

Key Features

Multiple Magazine Conveyor

multiple magazine conveyor

1D / 2D / RFID Magazine Reader

1D / 2D / RFID Magazine Reader

Other Features

Quality Analysis System

Quality Analysis System icon

Generate Report

Generate Report icon


E-Map icon

High-Resolution Camera & Auto focusing

camera icon

8 to 1 Centralised Verification System

8 to 1 Centralised Verification System

SECSGEM Compatible


Auto frame width Adjustment

Auto frame width Adjustment

Able to perform offline verification before reject

Able to perform offline verification before reject

Optional Features

Reject Modules (inking, sorter & laser marking)

Reject Modules

Bottom inspection

Bottom inspection

Long Term Storage (up to 3 months)

Long Term Storage

Offline Teaching

Offline Teaching


Substrate, Leadframe and Pallet

Substrate, Leadframe and Pallet


Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch