Description
Our AOI Solutions Supported the Backend of Semiconductor Manufacturing Process

ALPHA SERIES
High-Performance SWIR Wafer AOI Solutions
Alpha series is one of the successful semiconductor defect inspection series Cortex designed. The high-performance Wafer AOI solutions automatically detect major or minor wafer defects providing reliable and precise results. It is suitable for wafer defect inspection before and after the sawing process. It also supports various types and sizes of wafers in semiconductor, electronics, automotive, medical and Optoelectronic industries. The upgraded series of wafer AOI now comes with SWIR technology that is capable to inspect the die inner layer and die sidewall defects. The new SWIR wafer inspection solution is equipped with higher specification hardware and software to speed up the wafer transition & inspection process.

BENEFITS OF AOI INSPECTION
To Business

Full Solution
Check, Mark, Sort

Increase Quality
Quick identify & Fix defects process

Improve Reputation
Less defects products increase
customer satisfaction

Reduce Wastage
Defects can be detect at the earlier
stage

Save Time & Cost
Process can be simplify and less
labour cost

24 hours operation
Maximize production yield
To User

Inspection cover each unit of
products without miss

Data Collection
Enabling tracking & data analysis

One AOI Machine
Multiple types defects inspection

Easy Control
Simple Instruction manual with
own recipe setting

Reliable Result
Consistent inspection criteria

100% Automatic Process
Replace manual inspection
Key Features
NEW SWIR Camera-Inner Layer Inspection Is Available Now!
Come with Colour Camera & Mono Camera


Fitted Wafer Size & Types

Other Features
Dual Fork Robot for quick wafer transition

Auto Teaching recipe setting & Quality Analysis System

Auto-alignment for bare wafer, orientation check

Auto focus on height with auto focus camera and motorized objectives lens

Able to perform offline verification without disturbing the on-going process

Stable machine structure with granite table to prevent vibration

Optional Features
Marking

Bottom Inspection

Semi-Auto or Fully Auto

INSPECTION CAPABILITIES
Chipping, Cracks, Stains, Blistering, Scratches, lifted metal, meandering, damaged bump, un-separation, 0ff set –cut, foreign material and etc

*In order to protect our customer design, drawing act as illustration purpose only. Contact us for more information

ELECTRA SERIES
Tape & Reel AOI Solutions
Electra is a powerful High-Speed Tape and Reel AOI Solutions that is capable to inspect fine defects.
Its support various pocket width of tape and reel.
BENEFITS OF AOI INSPECTION
To Business

Full Solution
Check, Mark, Sort

Increase Quality
Quick identify & Fix defects process

Improve Reputation
Less defects products increase
customer satisfaction

Reduce Wastage
Defects can be detect at the earlier
stage

Save Time & Cost
Process can be simplify and less
labour cost

24 hours operation
Maximize production yield
To User

Inspection cover each unit of
products without miss

Data Collection
Enabling tracking & data analysis

One AOI Machine
Multiple types defects inspection

Easy Control
Simple Instruction manual with
own recipe setting

Reliable Result
Consistent inspection criteria

100% Automatic Process
Replace manual inspection
Key Features
Dual Track Operation

Autosave failed defect images

Fine detection to 4 mils defects

Line Scan 8K, 12K, 16K Camera Capabilities

Other Features
Single software with multiple inspection recipe

Network connectivity for output to server

Defect mapping with images

Optional Features
Laser marking system

Offline Programming

2D code reading

NAS Storage Solution

INSPECTION PRODUCTS
Tape & Reel

INSPECTION CAPABILITIES
Scratches, chipping, wrong marking, wrong orientation, foreign material and lead bend
Scratch

Chip Out

Wrong Marking

Wrong Orientation

Foreign Material

Lead Bend


VEGA SERIES
High Precision 3D Wirebond AOI Solution
Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on wirebond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defect but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.
BENEFITS OF AOI INSPECTION
To Business

Full Solution
Check, Mark, Sort

Increase Quality
Quick identify & Fix defects process

Improve Reputation
Less defects products increase
customer satisfaction

Reduce Wastage
Defects can be detect at the earlier
stage

Save Time & Cost
Process can be simplify and less
labour cost

24 hours operation
Maximize production yield
To User

Inspection cover each unit of
products without miss

Data Collection
Enabling tracking & data analysis

One AOI Machine
Multiple types defects inspection

Easy Control
Simple Instruction manual with
own recipe setting

Reliable Result
Consistent inspection criteria

100% Automatic Process
Replace manual inspection
Key Features
Multiple Magazine Conveyor

1D / 2D / RFID Magazine Reader

Other Features
Quality Analysis System

Generate Report

E-Map

High-Resolution Camera & Auto focusing

8 to 1 Centralised Verification System

SECSGEM Compatible

Auto frame width Adjustment

Able to perform offline verification before reject

Optional Features
Reject Modules (inking, sorter & laser marking)

Bottom inspection

Long Term Storage (up to 3 months)

Offline Teaching

INSPECTION PRODUCTS
Substrate, Leadframe and Pallet

INSPECTION CAPABILITIES
Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch

MIRA SERIES
Strip to Strip AOI Solutions
Mira is a High-Speed Strip to Strip AOI solution with multiple inspection capabilities and low energy consumption solutions.
Its also able to do inspection on die attached and various types of leadframe and package.

BENEFITS OF AOI INSPECTION
To Business

Full Solution
Check, Mark, Sort

Increase Quality
Quick identify & Fix defects
process

Improve Reputation
Less defects products
increase customer
satisfaction

Low Energy Consumption
For greener earth

Reduce Wastage
Defects can be detect
at the earlier stage

Save Time & Cost
Process can be simplify and
less labour cost

24 hours operation
Maximize production yield

RoHS Compliance
Component
To User

Inspection cover each unit of
products without miss

Data Collection
Enabling tracking & data analysis

One AOI Machine
Multiple types defects inspection

Easy Control
Simple Instruction manual with
own recipe setting

Reliable Result
Consistent inspection criteria

100% Automatic Process
Replace manual inspection
Key Features
Dual Scan Capabilities Top & Bottom Inspection

1D & 2D Reading

Fine detection to 2 mils defects

Line Scan 8K, 12K, 16K Camera Capabilities

Other Features
Single software with multiple inspection recipe

Network connectivity for output to server

Defect mapping with images

Optional Features
Laser marking system

Able to perform offline verification without disturbing the on-going process

NAS Storage Solution

INSPECTION PRODUCTS
Package, Leadframe, Die Attach

INSPECTION CAPABILITIES
Mark & Cosmetics inspection – Rough surface, void, package scratches, incomplete fill, crown flash (2D), ID Pin Height, Chip on package, raised flag, package offset, foreign material, pin1 chip, flash on EP and etc
