Alpha – Wafer Die AOI

Description

Our AOI Solutions Supported the Backend of Semiconductor Manufacturing Process

Finished Wafer

finished wafer icon

Wafer Inspection

Wafer Sawing

wafer sawing icon

Wafer Inspection

Die Attachment

die attachments icon

Die Inspection

die inspection AOI machine

Wire Bonding

wire bonding icon

Tape & Reel Inspection

Tape and Reel Inspection machine

IC Inspection

Lead Marking

lead marking icon

Leads Cutting

leads cutting icon

Leadframe Inspection

leadframe inspection machine

Package Moulding

package moulding icon

Wirebond Inspection

die inspection AOI machine

ALPHA SERIES

High-Performance SWIR Wafer AOI Solutions

Alpha series is one of the successful semiconductor defect inspection series Cortex designed. The high-performance Wafer AOI solutions automatically detect major or minor wafer defects providing reliable and precise results. It is suitable for wafer defect inspection before and after the sawing process. It also supports various types and sizes of wafers in semiconductor, electronics, automotive, medical and Optoelectronic industries. The upgraded series of wafer AOI now comes with SWIR technology that is capable to inspect the die inner layer and die sidewall defects. The new SWIR wafer inspection solution is equipped with higher specification hardware and software to speed up the wafer transition & inspection process.

alpha water die AOI

BENEFITS OF AOI INSPECTION

To Business

Full Solution Check, Mark, Sort icon

Full Solution
Check, Mark, Sort

winner badge

Increase Quality
Quick identify & Fix defects process

brand icon

Improve Reputation
Less defects products increase
customer satisfaction

reduce waste icon

Reduce Wastage
Defects can be detect at the earlier
stage

time and money icon

Save Time & Cost
Process can be simplify and less
labour cost

24 hours icon

24 hours operation
Maximize production yield

To User

inspection icon

Inspection cover each unit of
products without miss

data collection icon

Data Collection
Enabling tracking & data analysis

multiple detection

One AOI Machine
Multiple types defects inspection

easy control icon

Easy Control
Simple Instruction manual with
own recipe setting

reliable result icon

Reliable Result
Consistent inspection criteria

auto icon

100% Automatic Process
Replace manual inspection

Key Features

SWIR Technology – Inner Layer & Sidewall Inspection (WFi-37)

Other Features

Defect Detection 0.5um

Fine Die Inspection 300um x 300um

Auto Focus (Warp Compensation)

Host Map Format Adaptability [Klarf, XML, and etc)

Live Result Display

Auto Mapping

2D Code Reader

Ionizer & Hepa Filter

SECSGEM Compatible

Optional Features

Reject Modules

Offline Verification Software

Bottom Inspection

INSPECTION CAPABILITIES

Chipping, Cracks, Stains, Blistering, Scratches, lifted metal, meandering, damaged bump, un-separation, 0ff set –cut, foreign material, slant cut, discolor, measurement, OCR and etc

Wafer Sidewall Defects

Wafer Cosmetic Defects

*In order to protect our customer design, drawing act as illustration purpose only. Contact us for more information

Electra Tape & Reel AOI

ELECTRA SERIES

Tape & Reel AOI Solutions

Electra is a powerful High-Speed Tape and Reel AOI Solutions that is capable to inspect fine defects.

Its support various pocket width of tape and reel.

BENEFITS OF AOI INSPECTION

To Business

Full Solution Check, Mark, Sort icon

Full Solution
Check, Mark, Sort

winner badge

Increase Quality
Quick identify & Fix defects process

brand icon

Improve Reputation
Less defects products increase
customer satisfaction

reduce waste icon

Reduce Wastage
Defects can be detect at the earlier
stage

time and money icon

Save Time & Cost
Process can be simplify and less
labour cost

24 hours icon

24 hours operation
Maximize production yield

To User

inspection icon

Inspection cover each unit of
products without miss

data collection icon

Data Collection
Enabling tracking & data analysis

multiple detection

One AOI Machine
Multiple types defects inspection

easy control icon

Easy Control
Simple Instruction manual with
own recipe setting

reliable result icon

Reliable Result
Consistent inspection criteria

auto icon

100% Automatic Process
Replace manual inspection

Key Features

Dual Track Operation

dual track operation

Autosave failed defect images

autosave failed defect images

Fine detection to 4 mils defects

fine detection to 4 mils defects

Line Scan 8K, 12K, 16K Camera Capabilities

Line Scan 8K, 12K, 16K Camera Capabilities

Other Features

Single software with multiple inspection recipe

Single software with multiple inspection recipe

Network connectivity for output to server

Network connectivity for output to server

Defect mapping with images

defect mapping with images

Optional Features

Laser marking system

Laser marking system icon

Offline Programming

Able to perform offline

2D code reading

2D code reading

NAS Storage Solution

NAS Storage Solution

INSPECTION PRODUCTS

Tape & Reel

tape and reel products

INSPECTION CAPABILITIES

Scratches, chipping, wrong marking, wrong orientation, foreign material and lead bend

Scratch

scratch

Chip Out

Chip Out

Wrong Marking

wrong marking

Wrong Orientation

wrong orientation

Foreign Material

foreign material

Lead Bend

lead bend
High Precision 3D Wirebond AOI Solution

VEGA SERIES

High Precision 3D Wirebond AOI Solution

Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on wirebond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defect but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.

BENEFITS OF AOI INSPECTION

To Business

Full Solution Check, Mark, Sort icon

Full Solution
Check, Mark, Sort

winner badge

Increase Quality
Quick identify & Fix defects process

brand icon

Improve Reputation
Less defects products increase
customer satisfaction

reduce waste icon

Reduce Wastage
Defects can be detect at the earlier
stage

time and money icon

Save Time & Cost
Process can be simplify and less
labour cost

24 hours icon

24 hours operation
Maximize production yield

To User

inspection icon

Inspection cover each unit of
products without miss

data collection icon

Data Collection
Enabling tracking & data analysis

multiple detection

One AOI Machine
Multiple types defects inspection

easy control icon

Easy Control
Simple Instruction manual with
own recipe setting

reliable result icon

Reliable Result
Consistent inspection criteria

auto icon

100% Automatic Process
Replace manual inspection

Key Features

Multiple Magazine Conveyor

multiple magazine conveyor

1D / 2D / RFID Magazine Reader

1D / 2D / RFID Magazine Reader

Other Features

Quality Analysis System

Quality Analysis System icon

Generate Report

Generate Report icon

E-Map

E-Map icon

High-Resolution Camera & Auto focusing

camera icon

8 to 1 Centralised Verification System

8 to 1 Centralised Verification System

SECSGEM Compatible

SECSGEM icon

Auto frame width Adjustment

Auto frame width Adjustment

Able to perform offline verification before reject

Able to perform offline verification before reject

Optional Features

Reject Modules (inking, sorter & laser marking)

Reject Modules

Bottom inspection

Bottom inspection

Long Term Storage (up to 3 months)

Long Term Storage

Offline Teaching

Offline Teaching

INSPECTION PRODUCTS

Substrate, Leadframe and Pallet

Substrate, Leadframe and Pallet

INSPECTION CAPABILITIES

Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch

MIRA SERIES

Strip to Strip AOI Solutions

Mira is a High-Speed Strip to Strip AOI solution with multiple inspection capabilities and low energy consumption solutions.

Its also able to do inspection on die attached and various types of leadframe and package.

mira leadframe aoi

BENEFITS OF AOI INSPECTION

To Business

full solution check, mark, sort icon

Full Solution
Check, Mark, Sort

Increase Quality

Increase Quality
Quick identify & Fix defects
process

branding icon

Improve Reputation
Less defects products
increase customer
satisfaction

Low Energy Consumption icon

Low Energy Consumption
For greener earth

Reduce Wastage Defects icon

Reduce Wastage
Defects can be detect
at the earlier stage

Save Time & Cost icon

Save Time & Cost
Process can be simplify and
less labour cost

24 hours operation

24 hours operation
Maximize production yield

RoHS Compliance Component

RoHS Compliance
Component

To User

inspection icon

Inspection cover each unit of
products without miss

data collection icon

Data Collection
Enabling tracking & data analysis

multiple detection

One AOI Machine
Multiple types defects inspection

easy control icon

Easy Control
Simple Instruction manual with
own recipe setting

reliable result icon

Reliable Result
Consistent inspection criteria

auto icon

100% Automatic Process
Replace manual inspection

Key Features

Dual Scan Capabilities Top & Bottom Inspection

Dual Scan Capabilities Top & Bottom Inspection

1D & 2D Reading

1D & 2D Reading

Fine detection to 2 mils defects

fine detection to 4 mils defects

Line Scan 8K, 12K, 16K Camera Capabilities

Line Scan 8K, 12K, 16K Camera Capabilities

Other Features

Single software with multiple inspection recipe

Single software with multiple inspection recipe

Network connectivity for output to server

Network connectivity for output to server

Defect mapping with images

defect mapping with images

Optional Features

Laser marking system

Laser marking system icon

Able to perform offline verification without disturbing the on-going process

Able to perform offline

NAS Storage Solution

NAS Storage Solution

INSPECTION PRODUCTS

Package, Leadframe, Die Attach

Package, Leadframe, Die Attach

INSPECTION CAPABILITIES

Mark & Cosmetics inspection – Rough surface, void, package scratches, incomplete fill, crown flash (2D), ID Pin Height, Chip on package, raised flag, package offset, foreign material, pin1 chip, flash on EP and etc