Description
Our AOI Solutions Supported Front-end and Back-end of
Semiconductor Assembly Process
Finished Wafer
Wafer Inspection
Wafer Sawing
Wafer Inspection
Die Attachment
Die Inspection
Wire Bonding
Tape & Reel Inspection
Lead Marking
Tin Plating
Leads Cutting
Leadframe Inspection
Package Moulding
Wirebond Inspection
ASI-G2
2D Strip to Strip AOI Inspection
ASI-G2 is a High Speed 2D Strip to Strip AOI inspection solutions with multiple inspection capabilities and low energy consumption solutions.
Its also able to do inspection on various types of leadframe, package and die attach.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects
process
Improve Reputation
Less defects products
increase customer
satisfaction
Low Energy Consumption
For greener earth
Reduce Wastage
Defects can be detect
at the earlier stage
Save Time & Cost
Process can be simplify and
less labour cost
24 hours operation
Maximize production yield
RoHS Compliance
Component
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
Inspection cover each unit of
products without miss
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
Dual Scan Capabilities Top & Bottom Inspection
1D & 2D Reading
Fine detection to 2 mils defects
Line Scan 8K, 12K, 16K Camera Capabilities
Other Features
Single software with multiple inspection recipe
Network connectivity for output to server
Defect mapping with images
Optional Features
Laser marking system
Able to perform offline verification without disturbing the on-going process
2D code reading
NAS Storage Solution
INSPECTION PRODUCTS
Package, Leadframe, Die Attach
INSPECTION CAPABILITIES
Mark & Cosmetics inspection – Rough surface, void, package scratches, incomplete fill, crown flash (2D), ID Pin Height, Chip on package, raised flag, package offset, foreign material, pin1 chip, flash on EP and etc
WFi-3X SERIES
High Performance Wafer AOI Inspection
WFi-3X is a series of HIGH PEFRORMANCE Wafer AOI inspection solutions that automatically detect major or minor wafer defects while providing reliable and precise results. It’s supported various types of wafer in semiconductor, electronics, automotive, and medical, led industry.
Highly rated by top semiconductor supplier in the world.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects process
Improve Reputation
Less defects products increase
customer satisfaction
Reduce Wastage
Defects can be detect at the earlier
stage
Save Time & Cost
Process can be simplify and less
labour cost
24 hours operation
Maximize production yield
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
One AOI Machine
Multiple types defects inspection
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
NEW SWIR Camera-Inner Layer Inspection Is Available Now!
Come with Colour Camera. Mono Camera
Fitted Wafer Size & Types
Other Features
Dual Fork Robot for quick wafer transition
Auto Teaching recipe setting & Quality Analysis System
Auto-alignment for bare wafer, orientation check
Auto focus on height with auto focus camera and motorized objectives lens
Able to perform offline verification without disturbing the on-going process
Stable machine structure with granite table to prevent vibration
Optional Features
Marking
Bottom Inspection
Semi-Auto or Fully Auto
INSPECTION CAPABILITIES
Chipping, Cracks, Stains, Blistering, Scratches, lifted metal, meandering, damaged bump, un-separation, 0ff set –cut, foreign material and etc
*In order to protect our customer design, drawing act as illustration purpose only. Contact us for more information
AVIT Series
2D Tape & Reel AOI Inspection
AVIT is a powerful High-Speed Tape and Reel AOI Solutions that capable to inspect fine defects.
Its support various pocket width of tape and reel.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects process
Improve Reputation
Less defects products increase
customer satisfaction
Reduce Wastage
Defects can be detect at the earlier
stage
Save Time & Cost
Process can be simplify and less
labour cost
24 hours operation
Maximize production yield
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
One AOI Machine
Multiple types defects inspection
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
Dual Track Operation
Autosave failed defect images
Fine detection to 4 mils defects
Line Scan 8K, 12K, 16K Camera Capabilities
Other Features
Single software with multiple inspection recipe
Network connectivity for output to server
Defect mapping with images
Optional Features
Laser marking system
Offline Programming
2D code reading
NAS Storage Solution
INSPECTION PRODUCTS
Tape & Reel
INSPECTION CAPABILITIES
Scratches, chipping, wrong marking, wrong orientation, foreign material and lead bend
Scrtach
Chip Out
Wrong Marking
Wrong Orientation
Foreign Material
Lead Bend
WB-G2
High Precision 2D Wirebond AOI Inspection
WB-G2 is a High Precision 2D Wirebond AOI inspection solutions equip with the latest & high specification technologies which able to perform a smarter and high accuracy inspection on a very fine wirebond. Its also able to do inspection on various types of substrate, leadframe and pallet. Widely used by top semiconductor supplier in the world.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects process
Improve Reputation
Less defects products increase
customer satisfaction
Reduce Wastage
Defects can be detect at the earlier
stage
Save Time & Cost
Process can be simplify and less
labour cost
24 hours operation
Maximize production yield
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
Inspection cover each unit of
products without miss
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
Multiple Magazine Conveyor
1D / 2D / RFID Magazine Reader
Other Features
Quality Analysis System
Generate Report
E-Map
High-Resolution Camera & Auto focusing
8 to 1 Centralised Verification System
SECSGEM Compatible
Auto frame width Adjustment
Able to perform offline verification before reject
Optional Features
Reject Modules (inking, sorter & laser marking)
Bottom inspection
Long Term Storage (up to 3 months)
Offline Teaching
INSPECTION PRODUCTS
Substrate, Leadframe and Pallet
INSPECTION CAPABILITIES
Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch
