The Power of Cortex Wafer AOI: Revolutionizing Wafer Inspection with Integrated 2D, 3D, and SWIR Technologies
In the rapidly evolving and highly competitive semiconductor industry, ensuring the highest quality standards in wafer production is paramount, and that’s where our Cortex Automated Optical Inspection (AOI) solutions come into play. Combining 2D, 3D, and Short-Wave Infrared (SWIR) inspection technologies, Cortex AOI systems offer unparalleled precision and reliability in detecting and addressing wafer defects from 4” to 12” bare or ring wafers.
The Three Pillars of Cortex Wafer AOI Technology
2D Inspection: Cosmetic Perfection
Our 2D inspection technology is designed to meticulously examine the surface of wafers for cosmetic defects. This process involves high-resolution imaging to identify surface irregularities, such as scratches, stains, particles, and discolorations that could compromise the integrity and performance of the wafer. By ensuring cosmetic perfection, our 2D inspection system helps maintain the aesthetic and functional standards that are critical in semiconductor manufacturing.
Key Features:
- High-resolution imaging for detailed surface analysis
- Rapid scanning and processing for high throughput
3D Inspection: Precise Wafer Bump Measurement & Surface Topography Defect Detection (MEMS Topography)
The 3D inspection component of our Cortex AOI solutions focuses on the critical task of wafer bump measurement and inspection. Wafer bumps are essential for creating electrical connections between the wafer and external circuitry. Our 3D technology uses advanced algorithms and precise measurement tools to provide detailed profiles of each bump, measuring their height, volume, and shape with high precision.
Surface topography defects, such as irregularities in the wafer’s surface, can significantly impact the performance of semiconductor devices. 3D inspection technologies can accurately map the surface topography of the wafer, identifying any deviations such as surface height and flatness from the desired surface profile and pinpoint defects such as pits, bumps, and scratches that could affect device performance.
Key Features:
- Accurate 3D profiling for precise bump measurement
- Detection of height, volume, shape anomalies, and flatness
SWIR Inspection: Inner Die Defect Detection
The innovative SWIR (Short-Wave Infrared) inspection technology allows multi-layer inspection of the wafer’s internal structures because of its ability to penetrate the surface of materials that are opaque to visible light, such as silicon, and reveal its internal structures. This capability is vital for identifying inner die defects that are not visible with traditional inspection methods. SWIR inspection can detect issues such as cracks, voids, and inclusions within the wafer, ensuring the structural integrity and reliability of the final product. SWIR imaging provides superior contrast and clarity images that make it easier to distinguish between different materials and identify defects compared to traditional imaging methods, especially when inspecting through silicon and other semiconductor materials. This enhanced imaging capability allows for more accurate and detailed inspections. SWIR inspection is non-destructive, meaning that it does not harm the wafer, making it ideal for in-line inspection processes.
Key Features:
- Penetrates the surface to inspect internal structures
- Detects hidden defects that can affect performance
The Combined Strength of Cortex Wafer AOI
By integrating 2D, 3D, or SWIR inspection technologies, Cortex AOI systems provide a comprehensive approach to wafer inspection. This multi-faceted methodology ensures that every aspect of the wafer, from surface cosmetics to internal structures, meets the highest quality standards. The synergy of these technologies results in several key benefits:
Unmatched Precision: Each inspection method complements the others, providing a holistic view of the wafer’s condition. This ensures that no defect, whether on the surface or within, goes undetected.
Enhanced Reliability with Real-Time Monitoring: By identifying and addressing defects immediately with real-time data during the early production process, our AOI solutions help prevent downstream issues, reducing the risk of product failure and enhancing the overall reliability of semiconductor components.
Increased Efficiency: Automated inspection processes mean faster, more consistent results. Our AOI systems are designed for high throughput, allowing for rapid inspection without compromising accuracy.
Cost Savings: Early detection and correction of defects reduce waste and rework costs. By ensuring that only wafers meeting the highest standards proceed through the manufacturing process, Cortex AOI solutions contribute to significant cost savings.
Conclusion
By leveraging the combined power of 2D, 3D, and SWIR inspection technologies, we provide a comprehensive solution that addresses all aspects of wafer quality. Trust Cortex to help you achieve perfection in every wafer, ensuring that your products meet the highest standards of performance and reliability. For more information about our advanced Wafer AOI solutions and how they can benefit your manufacturing process, please contact us at findus@cortexrobotics.my.
