Description
Our AOI Solutions Supported the Backend of Semiconductor Manufacturing Process
Finished Wafer
Wafer Inspection
Wafer Sawing
Wafer Inspection
Die Attachment
Die Inspection
Wire Bonding
Tape & Reel Inspection
IC Inspection
Lead Marking
Leads Cutting
Leadframe Inspection
Package Moulding
Wirebond Inspection
ALPHA SERIES
High-Performance 2D + 3D/ SWIR Wafer AOI Solutions
The Alpha series stands as a leading solution in semiconductor defect inspection, expertly designed by Cortex. Our high-performance Wafer Automated Optical Inspection (AOI) systems deliver precise and reliable detection of both major and minor wafer defects, making them ideal for inspections before and after the sawing process. This versatile solution accommodates a wide range of wafer types and sizes across various industries, including semiconductor, electronics, automotive, medical, and optoelectronics.
The upgraded Alpha series now incorporates SWIR (Short-Wave Infrared) technology, enhancing its capability to inspect die inner layers and sidewall defects. This advanced SWIR wafer inspection solution is outfitted with state-of-the-art hardware and software, significantly accelerating wafer transition and inspection processes.
Furthermore, the latest iteration of our wafer AOI series features substantial advancements in 3D technology, enabling precise measurements of wafer bumps, warp, bow, total thickness variation (TTV), and thickness for silicon wafers, as well as for matted and polished glass wafers. This makes it particularly well-suited for advanced packaging applications.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects process
Improve Reputation
Less defects products increase
customer satisfaction
Reduce Wastage
Defects can be detect at the earlier
stage
Save Time & Cost
Process can be simplify and less
labour cost
24 hours operation
Maximize production yield
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
One AOI Machine
Multiple types defects inspection
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
Other Features
Defect Detection 0.5um
Fine Die Inspection 300um x 300um
Auto Focus (Warp Compensation)
Host Map Format Adaptability [Klarf, XML, and etc)
Live Result Display
Auto Mapping
2D Code Reader
Ionizer & Hepa Filter
SECSGEM Compatible
Optional Features
Reject Modules
Offline Verification Software
Bottom Inspection
INSPECTION CAPABILITIES
Chipping, Cracks, Stains, Blistering, Scratches, lifted metal, meandering, damaged bump, un-separation, 0ff set –cut, foreign material, slant cut, discolor, measurement, OCR and etc
*In order to protect our customer design, drawing act as illustration purpose only. Contact us for more information
ELECTRA SERIES
Tape & Reel AOI Solutions
Electra is a powerful High-Speed Tape and Reel AOI Solutions that is capable to inspect fine defects.
Its support various pocket width of tape and reel.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects process
Improve Reputation
Less defects products increase
customer satisfaction
Reduce Wastage
Defects can be detect at the earlier
stage
Save Time & Cost
Process can be simplify and less
labour cost
24 hours operation
Maximize production yield
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
One AOI Machine
Multiple types defects inspection
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
Dual Track Operation
Autosave failed defect images
Fine detection to 4 mils defects
Line Scan 8K, 12K, 16K Camera Capabilities
Other Features
Single software with multiple inspection recipe
Network connectivity for output to server
Defect mapping with images
Optional Features
Laser marking system
Offline Programming
2D code reading
NAS Storage Solution
INSPECTION PRODUCTS
Tape & Reel
INSPECTION CAPABILITIES
Scratches, chipping, wrong marking, wrong orientation, foreign material and lead bend
Scratch
Chip Out
Wrong Marking
Wrong Orientation
Foreign Material
Lead Bend
VEGA SERIES
High Precision 3D Wirebond AOI Solution
Vega is a High Precision Wire bond Inspection (AOI) solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on wirebond. It’s designed to support inspection before and after the wire-bonding process. It has the capability to inspect the top and bottom of the 3 types of products (Leadframe, Substrate & Pallet) with only a few steps of recipe change. The 3D Wire Bond Inspection has the ability to detect not only the common wire bond defect but also defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects process
Improve Reputation
Less defects products increase
customer satisfaction
Reduce Wastage
Defects can be detect at the earlier
stage
Save Time & Cost
Process can be simplify and less
labour cost
24 hours operation
Maximize production yield
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
One AOI Machine
Multiple types defects inspection
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
Multiple Magazine Conveyor
1D / 2D / RFID Magazine Reader
Other Features
Quality Analysis System
Generate Report
E-Map
High-Resolution Camera & Auto focusing
8 to 1 Centralised Verification System
SECSGEM Compatible
Auto frame width Adjustment
Able to perform offline verification before reject
Optional Features
Reject Modules (inking, sorter & laser marking)
Bottom inspection
Long Term Storage (up to 3 months)
Offline Teaching
INSPECTION PRODUCTS
Substrate, Leadframe and Pallet
INSPECTION CAPABILITIES
Wire short, wire broken, wire sagging, wire sweeping, torn bond, wire missing, double-bond, lifted wire, lifted ball, ball dimension, particle on die, die off set, epoxy overflow, lead bent, lifted stitch
MIRA SERIES
Strip to Strip AOI Solutions
Mira is a High-Speed Strip to Strip AOI solution with multiple inspection capabilities and low energy consumption solutions.
Its also able to do inspection on die attached and various types of leadframe and package.
BENEFITS OF AOI INSPECTION
To Business
Full Solution
Check, Mark, Sort
Increase Quality
Quick identify & Fix defects
process
Improve Reputation
Less defects products
increase customer
satisfaction
Low Energy Consumption
For greener earth
Reduce Wastage
Defects can be detect
at the earlier stage
Save Time & Cost
Process can be simplify and
less labour cost
24 hours operation
Maximize production yield
RoHS Compliance
Component
To User
Inspection cover each unit of
products without miss
Data Collection
Enabling tracking & data analysis
One AOI Machine
Multiple types defects inspection
Easy Control
Simple Instruction manual with
own recipe setting
Reliable Result
Consistent inspection criteria
100% Automatic Process
Replace manual inspection
Key Features
Dual Scan Capabilities Top & Bottom Inspection
1D & 2D Reading
Fine detection to 2 mils defects
Line Scan 8K, 12K, 16K Camera Capabilities
Other Features
Single software with multiple inspection recipe
Network connectivity for output to server
Defect mapping with images
Optional Features
Laser marking system
Able to perform offline verification without disturbing the on-going process
NAS Storage Solution
INSPECTION PRODUCTS
Package, Leadframe, Die Attach
INSPECTION CAPABILITIES
Mark & Cosmetics inspection – Rough surface, void, package scratches, incomplete fill, crown flash (2D), ID Pin Height, Chip on package, raised flag, package offset, foreign material, pin1 chip, flash on EP and etc
