Precision Problem-Solving: Cortex Robotics’ 3D Inspection Technology for Next-Gen Manufacturing
In the fast-paced semiconductor industry, precision and consistency are essential. Cortex Robotics, based in Penang, Malaysia, is leading the way with innovative 3D inspection solutions that address today’s most pressing manufacturing challenges. As a specialist in Automation Equipment, Advanced Inspection, Assembly, and Testing, Cortex is revolutionizing the semiconductor back-end process through high-technology methods and unmatched inspection capabilities.
3D Wafer & Wirebond Inspection: Raising the Bar for Quality Control
Cortex Robotics’ cutting-edge 3D inspection systems are engineered to tackle real-world manufacturing problems. By combining advanced optical and metrology technologies, these systems deliver meticulous, real-time analysis — critical for ensuring defect-free semiconductor components.
Key 3D Inspection Capabilities Include:
- Bond Line Thickness Measurement: Ensures optimal epoxy bonding between die and substrate, minimizing the risk of mechanical failure.
- Wire Loop Height Inspection: Accurate 3D measurement of wire loops prevents shorts or opens in wire connections — vital in maintaining electrical integrity.
- Ball Height and Lead Height Inspection: Detects inconsistencies in solder ball or leadframe height, supporting stable mechanical and electrical performance.
Through high-resolution 3D color mapping, variations in die height, ball size, lead position, and wire loops are instantly visualized, allowing engineers to identify and resolve defects efficiently. These advanced capabilities are core to Cortex’s 3D Wafer Inspection and 3D Wirebond Inspection solutions.
Next-Generation Glass Wafer Inspection
As the industry moves toward advanced packaging and photonics, glass wafer inspection has become increasingly critical. Cortex Robotics offers a robust suite of tools designed specifically for this emerging segment:
- Surface Defect Detection: Identifies foreign materials, scratches, cracks, and watermarks.
- Through-Glass Via (TGV) Inspection: Measures hole diameter, circularity, and placement — and flags deformities like hourglass shapes.
- TGV Defect Detection: Spots defects such as block holes, hole rings, or dent holes that can compromise device function.
- Glass Wafer Metrology: Provides data on wafer alignment, thickness, TTV (Total Thickness Variation), and warpage/stress levels.
These capabilities enable manufacturers to reduce material waste, improve yield, and maintain rigorous quality benchmarks.
Integrated AOI Systems for Complete Process Coverage
To support various inspection needs, Cortex offers a comprehensive range of 2D and 3D AOI systems designed for back-end semiconductor manufacturing:
- 3D Wafer AOI (Alpha Series)
- 3D Diebond & 3D Wirebond AOI (Vega + Pulsar Series)
- 3D Leadframe AOI (Vega + Pulsar Series)
- IC Turret AOI (Meteor Series)
- Tape & Reel AOI (Electra Series)
Each system is scalable and production-ready, ensuring high accuracy and seamless integration into modern factory environments.
Your Technology Partner in Precision Inspection
Cortex Robotics is more than a technology provider — it’s a solution partner for manufacturers seeking high-performance, reliable inspection systems. With ongoing investments in R&D and customer collaboration, Cortex is shaping the future of semiconductor quality assurance.
From 3D Wafer Inspection to 3D Wirebond Inspection, Cortex’s high-tech systems give customers the edge to build smarter, faster, and better — all while meeting the increasing demands of global semiconductor markets.
