Description
EQUIPMENTS
Wirebond AOI
Main Features Highlight
- Auto Focusing
- Perform detection after the die bonding and wire bonding process.
- Optional reject modules (inking, sorter & laser marking)
- Ability to change magnification for different products or specific objects.
- Top and Bottom inspection
- 3rd Optical & 100% VI inspection
- WLP (Wafer Level Packaging) Inspection
- Auto Teaching System & Quality Analysis Features
- Scalable to protect your investment
- Ability to offline verify before rejecting
Inspected Products
- Optoelectronics, Semiconductors, PCBA, lead frame, substrates, pallets and more.
- Transparent or translucent materials such as LED lenses, glass and more.
Inspection Capabilities
Defect Inspection
3D Inspection (optional with laser sensor)
Other Equipments
Enquiry Form
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Contact Us
Cortex Robotics Sdn Bhd.
address
72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.
T: +604 – 611 0110
E: info@cortexrobotics.my
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