Wirebond AOI

Die & Wirebond AOI

Category:

Description

EQUIPMENTS

Wirebond AOI

Main Features Highlight

  • Perform detection after the die bonding and wire bonding process.
  • Ability to focus on different heights (e.g. LED wirebond and lenses.
  • Ability to change magnification for different products or  specific objects.
  • Bottom inspection
  • 3rd Optical & 100% VI inspection
  • WLP (Wafer Level Packaging) Inspection

Inspected Products

  • Optoelectronics, Semiconductors, PCBA
  • Transparent or translucent materials such as LED lenses, glass and more.

Inspection Capabilities

Surface Cosmetic Inspection

3D Inspection (optional with laser sensor)

Enquiry Form

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Contact Us

Cortex Robotics Sdn Bhd.

address

72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.

T: +604 – 611 0110
E: info@cortexrobotics.my

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