Description
EQUIPMENTS
Die & Wirebond AOI
Main Features Highlight
- Perform detection after the die bonding and wire bonding process.
- Ability to focus on different heights (e.g. LED wirebond and lenses.
- Ability to change magnification for different products or specific objects.
- Bottom inspection
- 3rd Optical & 100% VI inspection
- WLP (Wafer Level Packaging) Inspection
Inspected Products
- Optoelectronics, Semiconductors, PCBA
- Transparent or translucent materials such as LED lenses, glass and more.
Inspection Capabilities
Surface Cosmetic Inspection
3D Inspection (optional with laser sensor)
Other Equipments
Enquiry Form
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Contact Us
Cortex Robotics Sdn Bhd.
address
72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.
T: +604 – 611 0110
F: +604 – 611 0110
E: info@cortexrobotics.my
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