Die & Wirebond AOI

Category:

Description

EQUIPMENTS

Die & Wirebond AOI

Main Features Highlight

  • Perform detection after the die bonding and wire bonding process.
  • Ability to focus on different heights (e.g. LED wirebond and lenses.
  • Ability to change magnification for different products or  specific objects.
  • Bottom inspection
  • 3rd Optical & 100% VI inspection
  • WLP (Wafer Level Packaging) Inspection

Inspected Products

  • Optoelectronics, Semiconductors, PCBA
  • Transparent or translucent materials such as LED lenses, glass and more.

Inspection Capabilities

Surface Cosmetic Inspection

Ball Size

Stitch Size

Contamination

Crack

Chipping

Scratches

Glue Insufficent

Sway Wire

Offst

Orientation

Double Bond

Broken Wire

3D Inspection (optional with laser sensor)

Wire Loop Height

Die Flatness

Die Tilt

Lifted Ball

Lifted Stitch

Contact Us

Cortex Robotics Sdn Bhd.

address

72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.

T: +604 – 611 0110
F: +604 – 611 0110
E: info@cortexrobotics.my