Die Inspection

Die Inspection

Category:

Description

EQUIPMENTS

Die Inspection

Wafer Die AOI

Main Features Highlight

  • Fully automatic with inline integration.
  • Dock third party loader & unloader for a fully automated solution.
  • Ability to focus on different heights.
  • Change magnification for different products.
  • Bottom Inspection.
  • WLP (Wafer Level Packaging) Inspection.
  • Machine support inline integration with SMEMA communication.
  • Measure, collect data and qualify your production samples.
  • Product can be inspected on a wafer/user made jig/fixtures.

Inspected Products

Wafer
Semiconductors
Optoelectronics

Enquiry Form

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Contact Us

Cortex Robotics Sdn Bhd.

address

72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.

T: +604 – 611 0110
E: info@cortexrobotics.my

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