Description
EQUIPMENTS
Die Inspection
Main Features Highlight
- Ability to focus on different heights
- Change magnification for different products.
- Bottom Inspection
- WLP (Wafer Level Packaging) Inspection
Inspected Products
Wafer
Semiconductors
Optoelectronics
Inspection Capabilities
Surface Cosmetic Inspection
3D Measurement + Flatness
Other Equipments
Enquiry Form
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Contact Us
Cortex Robotics Sdn Bhd.
address
72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.
T: +604 – 611 0110
E: info@cortexrobotics.my
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