Description
EQUIPMENTS
Die Inspection
Main Features Highlight
- Fully automatic with inline integration.
- Dock third party loader & unloader for a fully automated solution.
- Ability to focus on different heights.
- Change magnification for different products.
- Bottom Inspection.
- WLP (Wafer Level Packaging) Inspection.
- Machine support inline integration with SMEMA communication.
- Measure, collect data and qualify your production samples.
- Product can be inspected on a wafer/user made jig/fixtures.
Inspected Products
Wafer
Semiconductors
Optoelectronics
Other Equipments
Enquiry Form
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Contact Us
Cortex Robotics Sdn Bhd.
address
72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.
T: +604 – 611 0110
E: info@cortexrobotics.my
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