Description
EQUIPMENTS
Die Inspection
Main Features Highlight
- Ability to focus on different heights
- Change magnification for different products.
- Bottom Inspection
- WLP (Wafer Level Packaging) Inspection
Inspected Products
Wafer
Semiconductors
Optoelectronics
Inspection Capabilities
Surface Cosmetic Inspection
Contamination
Crack
Chipping
Scratches
Orientation
Offset
3D Measurement + Flatness
Surface Topology
Flatness
Similar Equipments
Contact Us
Cortex Robotics Sdn Bhd.
address
72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.
T: +604 – 611 0110
F: +604 – 611 0110
E: info@cortexrobotics.my
social media
quick link
