Die Inspection

Category:

Description

EQUIPMENTS

Die Inspection

Main Features Highlight

  • Ability to focus on different heights
  • Change magnification for different products.
  • Bottom Inspection
  • WLP (Wafer Level Packaging) Inspection

Inspected Products

Wafer
Semiconductors
Optoelectronics

Inspection Capabilities

Surface Cosmetic Inspection

Contamination

Crack

Chipping

Scratches

Orientation

Offset

3D Measurement + Flatness

Surface Topology

Flatness

Contact Us

Cortex Robotics Sdn Bhd.

address

72-2-6, Arena Curve, Jalan Mahsuri,
11950 Bayan Lepas, Penang, Malaysia.

T: +604 – 611 0110
F: +604 – 611 0110
E: info@cortexrobotics.my